agilent hsms-8101, 8202, 8207, 8209 surface mount microwave schottky mixer diodes data sheet features ? optimized for use at 10-14 ghz ? low capacitance ? low conversion loss ? low rd ? low cost surface mount plastic package ? lead-free option available plastic sot-23 package description/applications these low cost microwave schottky diodes are specifically designed for use at x/ku-bands and are ideal for dbs and vsat downconverter applications. they are available in sot-23 and sot-143 standard package configurations. note that agilent's manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assur- ing the highest degree of match. package lead code identification (top view) absolute maximum ratings [1] , t a = +25 c symbol parameter unit min. max. p t total device dissipation [2] mw 75 p iv peak inverse voltage v 4 t j junction temperature c +150 t stg , t op storage and operating c -65 +150 temperature series #2 single #1 12 3 ring quad #7 12 34 12 3 cross-over quad #9 12 34 plastic sot-143 package notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. measured in an infinite heat sink at t case = 25 c. derate linearly to zero at 150 c per diode. attention: observe precautions for handling electrostatic sensitive devices. esd machine model (class a) esd human body model (class 0) refer to agilent application note a004r: electrostatic discharge damage and control.
2 dc electrical specifications, t a = 25 c symbol parameters and test conditions units min. max. min. max. min. max. min. max. v br breakdown voltage v 4 4 4 4 i r = 10 a c t total capacitance pf 0.26 0.26 0.26 0.26 v r = 0 v, f = 1 mhz ? c t capacitance difference pf 0.04 0.04 0.04 v r = 0 v, f = 1 mhz r d dynamic resistance ? 14 14 14 14 i f = 5 ma ? r d dynamic resistance difference ? 222 i f = 5 ma v f forward voltage mv 250 350 250 350 250 350 250 350 i f = 1 ma ? v f forward voltage difference mv 20 20 20 i f = 1 ma lead code 1 2 7 9 package marking code r1x 2rx r7x r9x where x is date code rf electrical parameters, t a = 25 c symbol parameter units typical l c conversion loss at 12 ghz db 6.3 z if if impedance ? 150 swr swr at 12 ghz 1.2 note: dc load resistance = 0 ? ; lo power = 1 mw. spice parameters i s = 4.6 e-8 e g = 0.69 tt = 0 r s = 6 c jo = 0.18 e-12 n = 1.09 p b (v j ) = 0.5 b v = 7.3 m = 0.5 i bv = 10e-5 fc = 0.5 linear equivalent circuit 0.17 pf r j 0.08 pf 1.0 nh 1.3 nh 6 ? self bias 1 ma 2.5 ma r j 256 142 hsms-8202 hsms-8207 hsms-8209 hsms-8101
3 typical performance, t c = 25 c forward voltage (v) figure 1. typical forward current vs. forward voltage at three temperatures. 100 10 1 0.1 0.01 forward current (ma) 0 0.2 0.4 0.6 0.8 v - forward voltage (v) figure 2. typical vf match, hsms- 820x pairs and quads. 30 10 i f - forward current (ma) ? v f - forward voltage difference (mv ) 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 1 0.3 30 10 1 0.3 i f (left scale) ? v f (right scale) local oscillator power (dbm) figure 3. typical conversion loss vs. local oscillator power. 9 8 7 6 conversion loss (db) ? 5 ? ? 1 3 5 7 9 11 13 t a = +125 c t a = +25 c t a = ?5 c profile option descriptions -blk = bulk -tr1 = 3k pc. tape and reel, device orientation figures 4, 5 -tr2 = 10k pc. tape and reel, device orientation figures 4, 5 tape and reeling conforms to electronic industries rs-481, taping of surface mounted components for automated placement. for lead-free option, the part number will have the character "g" at the end, eg. -tr2g for a 10k pc lead-free reel. ordering information specify part number followed by option. for example: hsms - 8101 - xxx bulk or tape and reel option part number surface mount schottky device orientation figure 5. option -tr1/-tr2 for sot-143 packages. figure 4. option -tr1/-tr2 for sot-23 packages. user feed direction cover tape carrier tape reel note: "ab" represents package marking code. "c" represents date code. end vie w 8 mm 4 mm top view abc abc abc abc note: "ab" represents package marking code. "c" re p resents date code. end vie w 8 mm 4 mm top view abc abc abc abc
4 outline 143 (sot-143) package dimensions outline 23 (sot-23) package characteristics lead material ...................................................................................... alloy 42 lead finish ................................... tin-lead 85-15% (non lead-free option) or tin 100% (lead-free option) maximum soldering temperature .............................. 260 c for 5 seconds minimum lead strength .......................................................... 2 pounds pull typical package inductance .................................................................. 2 nh typical package capacitance .............................. 0.08 pf (opposite leads) e b e2 e1 e1 c e xxx l d a a1 notes: xxx-package marking drawings are not to scale dimensions (mm) min. 0.79 0.000 0.37 0.086 2.73 1.15 0.89 1.78 0.45 2.10 0.45 max. 1.20 0.100 0.54 0.152 3.13 1.50 1.02 2.04 0.60 2.70 0.69 symbol a a1 b c d e1 e e1 e2 e l e b e2 b1 e1 e1 c e xxx l d a a1 notes: xxx-package marking drawings are not to scale dimensions (mm) min. 0.79 0.013 0.36 0.76 0.086 2.80 1.20 0.89 1.78 0.45 2.10 0.45 max. 1.097 0.10 0.54 0.92 0.152 3.06 1.40 1.02 2.04 0.60 2.65 0.69 symbol a a1 b b1 c d e1 e e1 e2 e l e 0.081 2.05 0.071 1.8 0.112 2.85 0.079 2 0.033 0.85 0.048 1.2 0.114 2.9 0.033 0.85 0.047 1.2 0.031 0.8 0.033 0.85 dimensions in inches mm 0.039 1 0.039 1 0.079 2.0 0.031 0.8 dimensions in inches mm 0.035 0.9 recommended pcb pad layout for agilents sot-23 products recommended pcb pad layout for agilents sot-143 products
5 tape dimensions and product orientation for outline sot-23 9 max a 0 p p 0 d p 2 e f w d 1 ko 8 max b 0 13.5 max t1 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 3.15 0.10 2.77 0.10 1.22 0.10 4.00 0.10 1.00 + 0.05 0.124 0.004 0.109 0.004 0.048 0.004 0.157 0.004 0.039 0.002 cavity diameter pitch position d p 0 e 1.50 + 0.10 4.00 0.10 1.75 0.10 0.059 + 0.004 0.157 0.004 0.069 0.004 perforation width thickness w t1 8.00 + 0.30 ? 0.10 0.229 0.013 0.315 + 0.012 ? 0.004 0.009 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance between centerline
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (65) 6756 2394 india, australia, new zealand: (65) 6755 1939 japan: (+81 3) 3335-8152(domestic/international), or 0120-61-1280(domestic only) korea: (65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (65) 6755 2044 taiwan: (65) 6755 1843 data subject to change. copyright ? 2005 agilent technologies, inc. obsoletes 5989-2496en september 26, 2005 5989-4024en w f e p 2 p 0 d p d 1 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 3.19 0.10 2.80 0.10 1.31 0.10 4.00 0.10 1.00 + 0.25 0.126 0.004 0.110 0.004 0.052 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.50 + 0.10 4.00 0.10 1.75 0.10 0.059 + 0.004 0.157 0.004 0.069 0.004 perforation width thickness w t1 8.00 + 0.30 ? 0.10 0.254 0.013 0.315+ 0.012 ? 0.004 0.0100 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance a 0 9 max 9 max t 1 b 0 k 0 tape dimensions and product orientation for outline sot-143
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